发明名称 |
PRINTED CIRCUIT SUBSTRATE WITH CONTROLLED PLACEMENT COVERCOAT LAYER |
摘要 |
A covercoated base substrate, comprising a base substrate (10) and a photoimageable covercoat layer (12) having a lead portion (15) extending beyond at least one, wherein the lead portion (15) has a controlled offset distance from the edge (17, 19), and a printed circuit (30) made from such base substrate (10) having at least one conductor including a trace (32) and a lead (34) wherein the covercoat (12) has a lead portion (15) covering at least one lead (34). A base substrate (10) may also have an opening (14) formed therethrough, the opening defining an interior edge (19) wherein the covercoat (12) extends beyond that interior edge (19). |
申请公布号 |
WO0115502(A1) |
申请公布日期 |
2001.03.01 |
申请号 |
WO2000US20227 |
申请日期 |
2000.07.25 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
SCHEIBNER, JOHN, B.;ANDERTON, ROBERT, M.;BUSTER, DAVID, L.;WILLIAMS, KRISTINE, J. |
分类号 |
H05K1/11;H05K3/28;H05K3/40 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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