发明名称 PRINTED CIRCUIT SUBSTRATE WITH CONTROLLED PLACEMENT COVERCOAT LAYER
摘要 A covercoated base substrate, comprising a base substrate (10) and a photoimageable covercoat layer (12) having a lead portion (15) extending beyond at least one, wherein the lead portion (15) has a controlled offset distance from the edge (17, 19), and a printed circuit (30) made from such base substrate (10) having at least one conductor including a trace (32) and a lead (34) wherein the covercoat (12) has a lead portion (15) covering at least one lead (34). A base substrate (10) may also have an opening (14) formed therethrough, the opening defining an interior edge (19) wherein the covercoat (12) extends beyond that interior edge (19).
申请公布号 WO0115502(A1) 申请公布日期 2001.03.01
申请号 WO2000US20227 申请日期 2000.07.25
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 SCHEIBNER, JOHN, B.;ANDERTON, ROBERT, M.;BUSTER, DAVID, L.;WILLIAMS, KRISTINE, J.
分类号 H05K1/11;H05K3/28;H05K3/40 主分类号 H05K1/11
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