PRINTED CIRCUIT SUBSTRATE WITH PHOTOIMAGEABLE COVERCOAT LAYER
摘要
A method of forming a covercoat layer on a base substrate useful in a printed circuit including the steps of: (1) providing a base substrate (10) having a first surface and a second surface; (2) positioning a liner (22) adjacent at least one surface of the base substrate (10), (3) forming a photoimageable covercoat layer (12) including a lead portion (15) formed on the liner (22); and (4) photoimaging the photoimageable covercoat layer (12).
申请公布号
WO0115501(A1)
申请公布日期
2001.03.01
申请号
WO2000US20176
申请日期
2000.07.25
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
ANDERTON, ROBERT, M.;BUSTER, DAVID, L.;SCHEIBNER, JOHN, B.