发明名称 HOT MELT PRESSURE SENSITIVE ADHESIVES FOR DIAPER CONSTRUCTION AND POSITIONING
摘要 <p>A hot melt pressure sensitive adhesive which comprises: (a) from 5 to less than 30 percent by weight basis the total of (a), (b) and (c) of a homogeneous linear or substantially linear interpolymer of ethylene and at least one C3-C20 alpha olefin having a density of at least 0.85 grams per cubic centimetre and a melt flow index below 30 dg/min; and (b) from 50 to 80 percent by weight basis the total of (a), (b) and (c) of a tackifying resin; and (c) from 5 to 35 percent by weight basis the total of (a), (b) and (c) of a plasticizer. The invention further relates to an absorbent article which incorporates such adhesive.</p>
申请公布号 WO2001014487(A1) 申请公布日期 2001.03.01
申请号 EP2000008187 申请日期 2000.08.21
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