| 摘要 |
<p>A method of forming a covercoat layer on a base substrate useful in a printed circuit including the steps of: (1) providing a base substrate (10) having a first surface and a second surface; (2) positioning a liner (22) adjacent at least one surface of the base substrate (10), (3) forming a photoimageable covercoat layer (12) including a lead portion (15) formed on the liner (22); and (4) photoimaging the photoimageable covercoat layer (12).</p> |
