| 摘要 |
<p>Two phase bridge rectifier, plastic encapsulated devices having four external terminal leads are batch fabricated using a workpiece of three stacked together generally planar lead frames wherein, at each of a plurality of device sites on the workpiece, two, two-chip stacks of semiconductor diode chips are provided. Each chip of each stack is sandwiched between a respective pair of bonding pads of either top and middle lead frames or middle and bottom lead frames. Each of the two bonding pads of the middle frame is connected to a respective one of a pair of integral terminal leads of the middle frame lying in the plane of the middle frame. An integral extension of one of the bonding pads of each of the top and bottom lead frames is bent out of the plane of its respective lead frame to include a flat terminal lead portion lying in the plane of the middle frame but not connected thereto. All four in-plane portions of the terminal leads include dam bars for use during device encapsulating; the dam bars from the top and bottom lead frames cooperating to form a single, in-plane dam bar. After encapsulation, individual devices are separated from the lead frame workpiece by severing ends of the four terminal leads from their respective lead frames.</p> |
