| 摘要 |
<p>A process for fabricating an electronic modules (30) having a thermally conductive substrate includes the step of thermally spraying of a dielectric layer (12) onto a baseplate (10). An electrically conductive layer (18) is then direct bonded to the thermally sprayed dielectric layer. The thermally sprayed dielectric layer can be formed at selected locations on the upper surface of the baseplate (10) by forming a pattern on the upper surface prior to carrying out the thermal spraying process. The electrically conductive layer (18) is patterned to form an interconnect pattern overlying the baseplate. Because the thermal spraying process can form extremely thin dielectric layers, an electronic module (30) fabricated in accordance with the invention exhibits high heat transfer characteristics. A heat producing electronic component (24), such as a power transistor, can be attached to the electrically conductive layer (18), and the heat generated therefrom dissipated through the baseplate (10).</p> |
