| 摘要 |
<p>A power module comprising a lead, projecting electrodes, an insulating sheet, and a semiconductor chip. The side faces and back face of the semiconductor chip and part of the lead are exposed from the insulating sheet, and therefore the heat dissipation ability of the power module is high. The projecting electrodes electrically connect the semiconductor chip and the lead, and therefore the conductive paths are short and the on-state resistance is low.</p> |
