发明名称 PRINTED CIRCUIT SUBSTRATE WITH CONTROLLED PLACEMENT COVERCOAT LAYER
摘要 <p>A covercoated base substrate, comprising a base substrate (10) and a photoimageable covercoat layer (12) having a lead portion (15) extending beyond at least one, wherein the lead portion (15) has a controlled offset distance from the edge (17, 19), and a printed circuit (30) made from such base substrate (10) having at least one conductor including a trace (32) and a lead (34) wherein the covercoat (12) has a lead portion (15) covering at least one lead (34). A base substrate (10) may also have an opening (14) formed therethrough, the opening defining an interior edge (19) wherein the covercoat (12) extends beyond that interior edge (19).</p>
申请公布号 WO2001015502(A1) 申请公布日期 2001.03.01
申请号 US2000020227 申请日期 2000.07.25
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