发明名称 COPPER WIRE FOR BONDING WIRE AND METHOD OF PRODUCING COPPER WIRE FOR BONDING WIRE
摘要 This bonding-wire copper strand is used to form a bonding wire. Said copper strand is formed from highly pure copper having a purity of at least 99.9999 mass pcnt , and has a strand diameter between 0.5 mm to 3.5 mm inclusive. The surface area ratio of the (001) plane is between 15 pcnt and 30 pcnt inclusive at a cross section perpendicular to the drawing direction.
申请公布号 PH12016500617(A1) 申请公布日期 2016.06.13
申请号 PH2017120165006 申请日期 2016.04.05
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 KUMAGAI SATOSHI;GU YU;SATO YUJI
分类号 C22C9/00;C22F1/00;C22F1/08;H01L21/60 主分类号 C22C9/00
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