发明名称 |
COPPER WIRE FOR BONDING WIRE AND METHOD OF PRODUCING COPPER WIRE FOR BONDING WIRE |
摘要 |
This bonding-wire copper strand is used to form a bonding wire. Said copper strand is formed from highly pure copper having a purity of at least 99.9999 mass pcnt , and has a strand diameter between 0.5 mm to 3.5 mm inclusive. The surface area ratio of the (001) plane is between 15 pcnt and 30 pcnt inclusive at a cross section perpendicular to the drawing direction. |
申请公布号 |
PH12016500617(A1) |
申请公布日期 |
2016.06.13 |
申请号 |
PH2017120165006 |
申请日期 |
2016.04.05 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
KUMAGAI SATOSHI;GU YU;SATO YUJI |
分类号 |
C22C9/00;C22F1/00;C22F1/08;H01L21/60 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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