| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a probe card capable of obtaining satisfactory contact at all times with each chip and the electrode pads of a CPS without using a multilayer ceramic substrate or anisotropic conductive rubber at the time of testing chips and CSPs in a wafer state, capable of adapting to narrow electrode pitches, and superior in durability at the time of high temperatures and a method for testing wafers on which a plurality of semiconductor devices are formed. SOLUTION: In a probe card for testing a wafer 51, a contact electrode 54 to be in contact with a wafer electrode 52 is provided on a flexible substrate 53, and the contact electrode 54 is led to an opening part 58 provided for the flexible substrate 53 by a wire 55 and is connected to the internal terminal 61 of a lower-side multilayer substrate 60. The internal terminal 61 mounts a wafer contactor led to an external terminal 63 by a wiring layer in the multilayer substrate 60 to a burn-in board via the external terminal 63. |
