摘要 |
PROBLEM TO BE SOLVED: To provide bonded parts by a boding method and an apparatus which efficiently bond two types of plastic sheet substrates with good quality. SOLUTION: A bonded part of two types of plastic sheet substrates can be produced by a bonding method and a bonding apparatus which are constituted by punching a first plastic sheet substrate having previously been laminated with a plastic film 6 of an adhesive, placing the punched substrate on a fixed stand 10 with the adhesive film side upward, laminating a second plastic sheet substrate of another adherend substrate thereon, and lowering a heating/pressing portion 9 having a predetermined temperature set by a temperature adjusting device to heat/press and bond the resulting laminate. The apparatus has a pressing time controller and a shock absorber 13 for absorbing an impact upon lowering the heating/pressing portion 9.
|