Pattern-transfer methods and masks

摘要

A pattern to be transferred to a wafer or other substrate is defined by a mask and divided into a plurality of sub-fields. The sub-fields include pattern lines having interconnection patterns for interconnecting patterns from the sub-fields on the wafer The interconnection patterns comprise one or more sections that transmit an incident charged-particle beam or light flux. The widths of the transmitting sections are selected to be less than or equal to the resolution limit of the optical system (CPB or light optical system) that images the sub-fields onto the wafer. In one embodiment, the widths of the transmitting sections monotonically increase or decrease at the ends towards the edges of the sub-fields. In another embodiment, the interconnection pattern is a square-spiral pattern formed of transmitting and absorbing segments. These interconnection patterns allow lines from connecting sub-field patterns to be connected with a reduced area of double-exposure even if the patterns are projected with an offset.