Multi-layer circuit board

摘要

A multi-layer circuit board formed by laminating a plurality of circuit boards each having lands arranged in many number in the form of a lattice or in a staggering manner on the side of the mounting surface and having circuit patterns with the ends on one side thereof being connected to said lands and with the ends on the other side thereof being drawn toward the outside from a region where said lands are arranged; wherein the lands for drawing the circuit patterns in a number not less than a+1 are arranged on the oblique lines of an isosceles triangle having a base formed by consecutive lands of a number of n and having oblique lines in the diagonal directions, the value n satisfying m>=k+1 of the two values of:wherein "a" is the number of the circuit patterns that can be arranged between the neighboring lands on the circuit board, and "n" is a parameter.