Electromechanical emissions grounding device for ultra high speed processors

摘要

A slot-type processor and one or more cache modules are incorporated into a vertically oriented, multiple chip module (CM) that is mounted to a printed circuit board. The MCM operates at ultra high frequencies and very high temperatures. Each component of the MCM has a heatsink, a thermal plate, and a series of mounting clips and screws which combine to dissipate heat. The heatsinks and thermal plates generate most of the electromagnetic interference (EMI) since they are not attached or grounded to the board. A series of alignment posts extend from the board and are used to individually and slidably mount each of the components to the board. Each thermal plate is grounded to the posts with grounding clips. The clips maintain contact with the thermal plate through wiping elements. Additional pressure is applied to the wiping elements through a post retaining bracket. The components are fully seated and retained in position with retaining cams.