| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject resin paste enabling rapid curing in oven curing, having adhesiveness strength in heating and excellent in stress relaxation property by including a specific epoxy resin, a latent curing agent, an imidazole compound and inorganic filler. SOLUTION: This resin paste comprises (A) 100 pts.wt. epoxy resin comprising (i) a liquid epoxy resin of the formula (t-Bu is tertiary butyl) and (ii) a reactive diluent in which weight ratio of the component (i) to the component (ii) is (60:40) to (90:10) (e.g. phenylglycidyl ether), (B) 0.5-5 pts.wt. latent curing agent, (C) 0.5-10 pts.wt. imidazole compound (e.g. 2-phenyl-4-methyl-5- hydroxymethylimidazole and (D) inorganic filler. Silver powder, silica filler, etc., is exemplified as the component D. |
