| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated substrate for packaging an electronic component in which electrical connection of an electronic component element such as piezo-resonator or the like is easy, in which external electrodes are formed so as to be suitable for surface mounting and which can be constituted by using dielectric ceramics having high dielectric constant and excellent mechanical impact resistance. SOLUTION: First internal electrodes 3, 4 are formed in a substrate main body 2 composed of dielectric ceramics. Holes 2e, 2f are formed from the upper surface 2c of the substrate main body 2 so as to reach the first internal electrodes 3, 4, but not to reach the lower surface. Internal connecting electrodes 8, 9 electrically connected to the first internal electrodes 3, 4 are formed in the holes 2e, 2f. Connecting electrodes 10, 11 are formed around the holes 2e, 2f on the upper surface 2c. The connecting electrodes 10, 11 are connected to the internal connecting electrodes 8, 9 and to an electronic component element mounted on the upper surface of the substrate main body 2.
|
