发明名称 |
Microelectronic assemblies with multiple leads |
摘要 |
A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.
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申请公布号 |
US6194291(B1) |
申请公布日期 |
2001.02.27 |
申请号 |
US19990372021 |
申请日期 |
1999.08.09 |
申请人 |
TESSERA, INC. |
发明人 |
DISTEFANO THOMAS H.;SMITH JOHN W. |
分类号 |
H01L21/60;H01L21/30;H01L21/48;H01L21/603;H01L23/12;H01L23/22;H01L23/48;H01L23/498;H01L23/50;H01L23/64;H01R12/71;H05K1/11;H05K3/36;H05K3/40;(IPC1-7):H01L21/30 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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