发明名称 |
High tensile strength electrodeposited copper foil |
摘要 |
A high tensile strength copper foil having a matte side roughness Rz of 2.5 mum or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.
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申请公布号 |
US6194056(B1) |
申请公布日期 |
2001.02.27 |
申请号 |
US19990349601 |
申请日期 |
1999.07.09 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
SAKAI HISAO;YOKOTA TOSHIKO;ASAI TSUTOMU;TAKAHASHI SUSUMU;SUZUKI MITSUO;DOBASHI MAKOTO;HARA YASUJI |
分类号 |
C25D1/04;C25D3/38;H05K1/09;(IPC1-7):B32B3/00 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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