| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which is capable of surely transmitting ultrasonic vibrations from a bonding tool to a chip to carry out a bonding operation stably and well and reducing a slip between a bonding tool and a chip to an irreducible minimum so as to lessen wear and tear on the bonding tool and elongate it in service life. SOLUTION: This device is equipped with a bonding stage 40 mounted with a ceramic board 5, a bonding tool 34 which sucks up and holds an SAW(surface acoustic wave) chip 1, an ultrasonic horn 33 which applies ultrasonic waves whose amplitude is vertical to the surface of the bonding stage 40 to the bonding tool 34, and a pressing mechanism which presses the bonding tool 34 toward the bonding stage 40.
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