发明名称 CHIP-SHAPED ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To lessen the number of processes to impart a conductive paste for forming first, second and third external electrodes on the outer surface of a component body. SOLUTION: In this component 31, external electrodes 39 to 41 are formed in such a way that they are put in a state that the electrodes 39 to 41 respectively encircle around the side surfaces 35 to 38 of a component body 32, and at the same time, the first external electrode 39, the second external electrode 40 and the third external electrode 41 are respectively made to position on the end on the side of the first end surface 33 of the component body 32, on the end on the side of the second end surface 34 of the component body 32 and between the electrodes 39 and 40. The electrodes 39 and 40 are respectively extended until reaching the peripheral edges of the end surfaces 33 and 34, but are formed in such a way that at least the central parts of the end surfaces 33 and 34 are made to expose. As a result, the electrodes 39 to 41 can be formed only by imparting a conductive paste in the directions opposing to each other of the side surfaces 35 to 38 of the component body 32.
申请公布号 JP2001057311(A) 申请公布日期 2001.02.27
申请号 JP19990232392 申请日期 1999.08.19
申请人 MURATA MFG CO LTD 发明人 OKUYAMA SHINGO
分类号 H01F17/00;H01F27/29;H01F41/04;H01G4/40;H03H7/01;(IPC1-7):H01F27/29 主分类号 H01F17/00
代理机构 代理人
主权项
地址