METAL CAP INSULATING FILM FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To realize a method through which an insulating film is easily formed on the surface of a metal cap. SOLUTION: This method is carried out through such a manner where an electronic component sealing metal cap 1 is provided to cover and seal up an element 20 mounted on the surface of a board 10 where terminal electrodes 11 and 12 are formed, and an insulating film 2 is formed on the surface of a metal cap 1 through electrodeposition coating. It is preferable that an insulating film is formed through an electrodeposition coating process holding the metal cap 1 with a jig and keeping it electrically conductive.