发明名称 CATIONIC ELECTRODEPOSITION COATING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a coating composition that can be uniformly dispersed in an electrodeposition coating bath and can give an electrodeposition coating film excellent in finish and corrosion resistance without using a lead compound or the like by adding an aqueous solution of a copper aliphatic hydroxycarboxylate to an electrodeposition coating material. SOLUTION: The aliphatic hydroxycarboxylic acids useful in the production of the aqueous solution of the copper aliphatic hydroxycarboxylate are monocarboxylic acids, among which lactic acid, dimethylolpropionic acid, and dimethylolbutyric acid are desirable. The copper compound used in the production of the aqueous solution of the copper aliphatic hydroxycarboxylate is desirably a copper hydroxide. The aqueous copper hydroxycarboxylate solution is obtained by reacting 1 mol of copper hydroxide with 1.2-2.7 mol of a hydroxycarboxylic acid. The amount of the aqueous copper hydroxycarboxylate solution added may widely vary according to the requirements for an electrodeposition coating material and usually corresponds to a copper content of 0.01-10 pts.wt. per 100 pts.wt. resin solids of the electrodeposition coating material.
申请公布号 JP2001055538(A) 申请公布日期 2001.02.27
申请号 JP19990231473 申请日期 1999.08.18
申请人 KANSAI PAINT CO LTD 发明人 NISHIGUCHI JIRO;HIRATO SHINJI;KAMIKADO KOJI
分类号 C09D175/04;C09D5/44;(IPC1-7):C09D175/04 主分类号 C09D175/04
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