Method and Apparatus for a Seal Ring Structure

摘要

A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

主权项

1. A method comprising:
forming a plurality of dies on a first wafer; forming a plurality of die seal rings on the first wafer, each die seal ring encircling a corresponding die of the plurality of dies; forming a first wafer seal ring and a second wafer seal ring on the first wafer, wherein the first wafer seal ring surrounds the plurality of dies, and wherein the second wafer seal ring surrounds the first wafer seal ring; forming an alignment post on a second wafer; aligning the first wafer with respect to the second wafer by inserting the alignment post in a gap between the first wafer seal ring and the second wafer seal ring; and bonding the first wafer to the second wafer to form a bonded structure.