发明名称 RESIN PRINT SEALING STENCIL PRINTING PLATE OF ELECTRIC PART
摘要 PROBLEM TO BE SOLVED: To lessen an interval of a thickness of a formation resinous layer and contribute to thinning of the resinous layer, etc., by a method wherein, in a stencil printing plate provided with a through hole in which a liquid sealing resin is transferred and supplied by applying a stencil printing plate printing means, an annular projected edge is formed at least inwardly from an upper end of a peripheral wall forming the through hole. SOLUTION: Through holes 2,... provided in a stencil printing plate 1 have a plane right-angled quadrilateral shape, and at an upper end of a through hole peripheral wall 2A forming the through hole 2, a projected edge 3 projecting inwardly in the range of al sides of four sides is formed. It is necessary that, in a part adjacent to a periphery of an opening at an upper end of the through hole 2, the projected edge 3 is formed in a region where a swelling d1 generates when a sealing resin is pushed in and filled up by operation of a squeegee (c). In reference to a diameter in a moving direction of the squeegee (c) of the through hole 2, a projection width of the projected edge 3 is normally 5 to 35% of the diameter, preferably 10 to 30%. Furthermore, all capacity of the projected edge 3 occupied in all the capacity of the through hole 2 is normally 10 to 50%, preferably 15 to 45%.
申请公布号 JP2001057373(A) 申请公布日期 2001.02.27
申请号 JP20000212937 申请日期 2000.07.13
申请人 JAPAN REC CO LTD 发明人 OKUNO ATSUSHI;OYAMA NORITAKA;IKEDA KAZUHIRO;OGISU YUJI;NAGAI KOUICHIROU;HASHIMOTO TSUNEICHI
分类号 H05K3/28;H01L21/56;(IPC1-7):H01L21/56 主分类号 H05K3/28
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