| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste for semiconductor enabling the curing both in an inline curing method and a batch curing method by compounding a specific resin, two kinds of specific curing agents, a specific compound, an organic borate and an inorganic filler. SOLUTION: The objective resin paste is obtained by compounding (A) 100 pts.wt. of an epoxy resin consisting of a liquid epoxy resin of formula I (t-Bu is a tertiary butyl group), (B) 20-60 pts.wt. of a phenol-curing agent, (C) 0.5-5 pts.wt. of a latent curing agent (e.g. dicyandiamide), (D) a silane compound (e.g.γ-glycidoxypropyltrimethoxysilane) of formula II (R1 is an aliphatic or aromatic functional group having an epoxy group; R2 is an alkoxy; R3 is an alkyl or alkoxy) in an amount of 10-60 pts.wt. based on 100 pts.wt. of the total of the components A, B and C, (E) an organo borate (e.g. tetraphenylphosphonium tetraphenyl borate) in an amount of 0.5-10 pts.wt. based on 100 pts.wt. of the total of the components A, B and C, and (F) an inorganic filler (e.g. silver powder). |
