| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing free from a halogen compound and a metal oxide, having sufficient flame resistance, and excellent in formability and the like by compounding an epoxy resin, a phenol resin, a specific phosphor compound and an inorganic filler. SOLUTION: This composition is obtained by compounding (A) an epoxy resin, (B) a phenol resin, (C) an organo phosphor compound of the formula (R is hydrogen or an alkyl; n is 2-10) in an amount of 10-50 wt.% and (D) an inorganic filler in an amount of 40-95 wt.%. The compounding ratio of the component B is preferably set so that the equivalent ratio of the epoxy group of the component A to the phenolic hydroxyl group of the component B, i.e., (epoxy group)/(phenolic hydroxyl group) is 0.1-10. Examples of the component A include aromatic epoxy resins of biphenyl-type or bisphenol-type, and aliphatic epoxy resins of cyclohexane derivatives or the like. Silica powder, alumina powder or the like is preferably used as the component D.
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