UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components

摘要

UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 mum and a siloxane component are provided in addition to the casting resin formulation.