| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which enables the further increase in long-term reliability.SOLUTION: A heat dissipation substrate 10 is arranged by laminating Cu layers 12A, 12B and metal A layers 14 each made of a metal A so that the Cu layers alternate with the metal A layers. The number of the Cu layers 12A, 12B and the metal A layers 14 thus laminated is 5-9 in total. In the heat dissipation substrate, an alloy layer is formed between each Cu layer 12A or 12B and the corresponding metal A layer 14, which includes the Cu or the metal A by 1-10 at%. The alloy layer is 30-400 nm in total thickness.SELECTED DRAWING: Figure 1 |
