发明名称 METHOD AND DEVICE FOR CONTROLLING TEMPERATURE FOR SOLDERING IN REFLOW FURNACE
摘要 PROBLEM TO BE SOLVED: To improve a mounting quality comprising part reliability of a printed wiring board. SOLUTION: A printed wiring board 110 moves in a reflow furnace 100 by a plurality of transportation conveyors (120a-12d) as well as buffer conveyors 130 (130a-130c) provided between the transportation conveyors 120. At the movement, a temperature measuring part 150 (15a-150c) measures the temperature on the printed wiring board 110 for outputting a temperature signal. Based on the temperature signal, a signal conversion part decides the transportation speed of the transportation conveyor 120 and the buffer conveyor 130 for outputting a speed signal. Further, based on the speed signal, a speed controller controls the transportation speed of the transportation conveyor 120 and the drive speed of the buffer conveyor 130. The heating time of the printed wiring board 110 is adjusted by controlling the transportation speed according to the temperature on the printed wiring board 110, so appropriate mounting of an electronic part is provided.
申请公布号 JP2001057470(A) 申请公布日期 2001.02.27
申请号 JP19990231418 申请日期 1999.08.18
申请人 NEC CORP 发明人 SUZUKI MOTOHARU
分类号 B23K1/00;B23K1/008;B23K31/02;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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