| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed wiring board with no deflection or breakage, nor penetration of chemical agent while manufacturing processes are decreased to reduce a manufacturing cost. SOLUTION: A first process where two both-side copper-plated lamination boards 21 are pasted with both-sided adhesive sheet 4 compristng heat-expansion particles which expand by five times, in volume, under heating at 160 deg.C or above in a pressure-sensitive adhesive, a second process where a circuit is generated on both surfaces of the pasted copper-plated lamination board, a third process where both circuit-worked surfaces are blackened while a copper foil is laminated through a prepreg 3, and a fourth process where the heat-expansion particles in the adhesive sheet are expanded under heating so that the adhesive strength of the adhesive sheet is lowered while the adhesive sheet is released, are provided. |
