| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device of which resin-sealing member is prevented from peeling from the time of resin sealing until mounting by a user, and a substrate used therefor. SOLUTION: A semiconductor element 2 represented by a broken line is mounted on the main surface of a substrate 1 and covered with a resin-sealing member 3 for sealing the semiconductor element 2. The substrate 1 except for inner lead regions and a certain region (corner portion CNR) is coated with a solder resist 41, which is provided for insulation of electrical connection between inner leads or plating leads. Lands 5 are formed on the rear surface of the substrate 1 and a solder resist 42 is formed in regions other than the lands. The corner portion CNR of the resin-sealed portion is not coated with the solder resist 41. At the corner portion CNR, the resin-sealing member 3 adheres to the substrate 1 itself, thereby resulting in strong adhesion.
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