STRESS COMPENSATION COMPOSITION AND SEMICONDUCTOR COMPONENT FORMED BY USE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor component provided with a stress compensating layer which can be optically demarcated and composition of stress compensating material. SOLUTION: Stress compensating material which can be optically demarcated is formed on a semiconductor wafer 11, and an opening is provided through a photolithography method. Then, conductive bumps 26 are formed thereon, and additional bumps 28 are each formed on the first conductive bumps 26. The stress compensating material is composed of optical initiator, epoxy of first refractive index, diluent, and filler. A combination of epoxy and diluent is nearly equal to filler in refractive index. The stress compensating material which can be optically demarcated can be formed on a semiconductor wafer where conductive bumps are provided. An opening is provided in the stress compensating layer to make the conductive bumps exposed. Additional bumps are each formed on first conductive bumps.