| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the warpage of a substrate with simple structure by inserting the projection of a first heat-resistant member into a through hole being formed on the substrate, and by bringing the flat surface of the first heat-reststant member into contact with one surface or the other of the substrate. SOLUTION: Via a perforation 13M being formed on a print aggregate substrate 13, first and second tool half bodies 21 and 22 are fitted integrally for assembling a warpage prevention tool 20, and the warpage prevention tool 20 is brought into contact with both the surfaces of the print aggregate substrate 13 for retaining. On soldering treatmnent, even when melted solder is sprayed onto an entire back surface 13B of the print aggregate substrate 13 in a case for forming closed space while the print aggregate substrate 13 where the warpage prevention tool 20 is mounted is supplied to a jet-type solder supply device, the warpage prevention tool 20 made of stainless steel is not deformed at all by the intense heat of the melted solder, and the melted solder does not adhere, thus continuously and flatly retaining surfaces 13A and 13B of the printed-circuit board 13. |
