发明名称 INDIRECT ADHESION STRUCTURE AND INDIRECT ADHESION METHOD
摘要 PROBLEM TO BE SOLVED: To almost uniformly keep the coating amt. or distribution of an adhesive to an intermediate holding member. SOLUTION: Through-holes 3a having a size capable of holding a filled adhesive 4 by surface tension are provided to the first and second bonding surfaces of an intermediate holding member 3. In this indirect adhesion structure, the adhesive 4 charged in the through holes 3a is held by surface tension because the through-holes 3a having a size capable of holding the filled adhesive 4 by surface tension are provided to the first and second bonding surfaces of the intermediate holding member. By this constitution, the dripping or offset of the adhesive 4 under its own weight is reduced and the coating amt. or distribution to the intermediate holding member 3 can be held almost uniformly.
申请公布号 JP2001054944(A) 申请公布日期 2001.02.27
申请号 JP19990232362 申请日期 1999.08.19
申请人 RICOH CO LTD 发明人 TAKEMOTO HIROSHI
分类号 H04N1/028;B41J2/01;C09J5/00;F16B11/00;(IPC1-7):B41J2/01 主分类号 H04N1/028
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