发明名称 CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, BONDED MATERIAL AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a curable resin composition emitting low odor, having high adhesivity (including the adhesivity to aluminum) including peeling strength and high moisture resistance to keep the adhesivity even under a condition of high humidity, etc., and useful as an adhesive composition by combining specific compounds. SOLUTION: The objective curable resin composition contains (A) a compound of formula Z-O-(R2)p-R1 [Z is (meth)acryloyl group; R1 is phenyl which may have 1-3C alkyl groups; R2 is C2H4, C3H6 or the like; (p) is 1-10], (B) a compound of formula Z-O-(R2O)p-H, (C) a compound of formula (R3 is H or a 1-4C alkyl; (q) is 0-8), (D) a compound of formula Z-O-R4 (R4 is a 5-16C alkyl), (E) a polymerization initiator and (F) a reducing agent. Preferably, the component E is (i) aβ-diketone chelate and/or aβ-ketoester or a combination of the component (i) and an aromatic amine and/or a pyridine derivative.
申请公布号 JP2001055423(A) 申请公布日期 2001.02.27
申请号 JP20000170031 申请日期 2000.06.07
申请人 DENKI KAGAKU KOGYO KK 发明人 SUDO HIROSHI;TAGUCHI KOICHI
分类号 C08F2/44;C08F4/40;C08F220/18;C08F220/28;C08F220/30;C08F290/06;C08F291/02;C09J4/02;C09J4/06;(IPC1-7):C08F220/30 主分类号 C08F2/44
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