| 摘要 |
PURPOSE: To provide a BGA-type semiconductor device package of a compact structure, provided with a heat sink in simple form for causing the heat generated in a semiconductor element to be radiated. CONSTITUTION: In a BGA-type semiconductor package provided with a heat sink member on a semiconductor chip, a heat sink member 2 is provided to stick fast on a planarized BGA substrate 1 in which to embed the semiconductor chip, and at the flattened BGA substrate 1, through-holes are arranged at many places, and moreover in the through-hole, a pin 5b consisting of the same member as that in the heat sink member 2 integrated with, at least the heat sink member is embedded, with its head protruding from the BGA board. |
