| 摘要 |
PURPOSE: To improve productivity and reliability by separating a plurality of semiconductor chips resin-sealed on an insulated substrate into the individual semiconductor devices. CONSTITUTION: A semiconductor chip 30 is mounted on an insulated substrate 10 by using insulation resin 20 for mounting. Next, the entire part of the single side 10a where a semiconductor chip 30 is mounted on the insulted substrate 10 on the insulated substrate 10 is sealed at a time with a transfer mold resin 50. Thereafter, an electrode ball 60 is formed for external connection to the single side 10b on the insulated substrate 10 where the semiconductor chip 30 is not mounted. Moreover, as the final process, the transfer mold resin 50 and insulated substrate 10 are cut simultaneously in the dicing process to obtain individual semiconductor devices. |
