| 摘要 |
PURPOSE: A circuit is provided to improve heat radiating property of a light emitting device where light emitting elements are fitted on a printed board, as well as light emitting efficiency, and realize making it light-weight compact in thickness and size. CONSTITUTION: A Cu pattern on which Ni is adhered is formed on a metallic board(11), and light emitting elements(10) are mounted thereon in a serial circuit, and then the serially connected metallic boards are connected in parallel. Since the Ni has superior corrosion resistance and high light reflection efficiency, the surface itself of a board can be utilized as a reflection plate. In addition, a lens is formed on the respective light emitting element and the light emitting efficiency can be improved. Furthermore, a first wiring(26) and a second wiring(27) are provided, so that a hybrid integrated circuit board(11) can be connected in parallel in a matrix form. |
