发明名称 SEMICONDUCTOR WAFER CENTERING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To accurately align the center of a semiconductor wafer and the position angle (orientation flat) of its flat when a semiconductor wafer is transferred. SOLUTION: This semiconductor wafer centering device is equipped with a wafer rotating means 4 which is mounted with a semiconductor wafer 1 and rotates it, an edge position detector 5 which detects data on the edge position of the wafer 1 through a non-contact manner, an A/D converter 24 which converts the output signals of the edge position detector 5 into digital signals related to the rotation angle of the wafer 1, a DMA data transfer means 26 which transfers the output of the A/D converter 24 to another circuit direct, a central processing unit(CPU) 27 which calculates the eccentric angle and eccentricity of a wafer 1 resting on the edge position signals and rotation angle signals of a wafer transferred by the DMA data transfer means 26, and a wafer drive means 4 and 22a which align the center of the wafer corresponding to the output of the central processing unit 27.</p>
申请公布号 JP2001057380(A) 申请公布日期 2001.02.27
申请号 JP20000163463 申请日期 2000.05.31
申请人 DAIHEN CORP 发明人 CHINEN RINTARO;MORIYAMA YUKIO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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