| 摘要 |
PURPOSE: To provide an X-ray inspecting apparatus capable of clearly judging the mounting state of a small-sized and highly densified electronic parts such as BGA or CSP to a substrate, particularly the lifting inferiority of a solder ball. CONSTITUTION: In the X-ray inspecting apparatus constituted so that an X-ray source 11 emitting X-rays and an X-ray detecting part 12 detecting X-rays are arranged in opposed relationship with a sample 13 inbetween and X-rays emitted from the X-ray source 11 to be transmitted through a sample are detected by the X-ray detecting part 12, the X-ray detecting part 12 is arranged so that the X-ray incident surface 12a thereof becomes parallel to an axis S and an oscillation means 16 oscillating the X-ray detecting means 12 centering around the axis S while always turning the X-ray incident surface 12a thereof in the same direction and a rotary means 15 rotating the X-ray source 11 around the axis S in synchronous relation to the X-ray detecting part 12.
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