| 摘要 |
PURPOSE: A polishing slurry is provided to improve a polishing rate and a productivity upon polishing a semiconductor device. CONSTITUTION: A polishing slurry comprises a water, a fumed silica having an average primary particle size of 9 to 60 nm and a spherical silica having an average primary particle size of 40 to 600 nm excluding the fumed silica, wherein a content of the whole silicas obtained by totaling the fumed silica and the spherical silica falls in a range of 1 to 40 % by weight. |
