| 摘要 |
<p>PURPOSE: An improvement of laser trimming characteristics of thin film resistor using refracting or non-reflecting barrier layer is provided to unnecessitate accurate control of the thickness of each layer and the optical characteristics of a thin film resistor, by a method wherein an integrated circuit is formed in a semiconductor device base body, a reflective layer is provided in such a way as to cover the base body, and a resistance layer is provided in such a way as to cover the reflective layer. CONSTITUTION: An integrated circuit with a precision trimmable resistor comprising a semiconductor device substrate, at least one device or an integrated circuit formed in the substrate, a reflective layer disposed over the substrate for reflecting a trimming laser beam, a trimmable resistor layer disposed over the reflective layer.</p> |
