发明名称 CONNECTED STRUCTURE
摘要 PURPOSE: To impart a connected structure comprising two electronic parts connected by an anisotropically electroconductive adhesive with a low conductive resistance at the connected section and sufficient adhesive strength while preventing squeeze-out of the anisotropically electroconductive adhesive. CONSTITUTION: A connected structure comprising a first electrode 2 on a first substrate 1 and a second electrode 4 on a second substrate 3 electrically connected to each other via an anisotropically electroconductive adhesive layer 5 satisfies the equation: 0.5x{(A1C1+A2C2)/(B+C)}=<X=<2x{(A1C1+A2C2)/(B+ C)}, provided that B+C=B1+C1=B2+C2, wherein A1 and B1 are the height and the width, respectively, of an electrode and C1 is the space between electrodes in the first electrode; and A2 and B2 are the height and the width, respectively, of an electrode and C2 is the space between electrodes in the second electrode; and X is the thickness of the electroconductive layer before connected.
申请公布号 KR20010015379(A) 申请公布日期 2001.02.26
申请号 KR20000041552 申请日期 2000.07.20
申请人 SONY CHEM CORP 发明人 KUMAKURA HIROYUKI
分类号 H05K1/14;C09J7/02;C09J9/02;G02F1/13;H01R4/04;H01R12/70;H01R12/79;H05K3/32;H05K3/36;(IPC1-7):H01R4/04 主分类号 H05K1/14
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