Device to apply coatings

摘要

A device for applying a coating on a component where the component includes an inner surface, an outer surface, and end surfaces. The coating device includes a supporting pedestal, a UV light-transparent cover plate, a first pumping device, and an injecting device. The supporting pedestal is configured for holding the inner surface of the component, the end surfaces and the outer surface are exposed in the forming cavity. A through hole is defined in the center of the pedestal and a forming cavity is defined between the cover plate and the component when the cover plate is placed and secured on the pedestal. The first pumping device applies suction to the through hole to hold the component on the pedestal and the injecting device injects UV light-curable coating material in liquid form into the forming cavity.

主权项

1. A coating device for coating a film on a component, the to-be-coated component comprising an inner surface, an outer surface opposite to the inner surface and an end surface connecting the inner surface and the outer surface, the coating device comprising:
a supporting pedestal configured for holding a component to be coated; the supporting pedestal comprising a through hole in the center thereof; a cover plate placing on the to-be-coated component and contact with the supporting pedestal, and defining a forming cavity between the cover plate and the component; a first pumping device connected with the through hole, and configured to fix the to-be-coated component on the supporting pedestal; an injecting device configured to inject a coating material into the forming cavity; wherein the supporting pedestal is configured for holding the inner surface, the end surface and the outer surface are exposed in the forming cavity, the coating material is filled in the forming cavity and forms the film over the outer surface and the end surface; and wherein the supporting pedestal comprises a lower plate, an upper plate, a spacing plate, and a first adsorption member, the through hole runs through respective centers of the lower plate, the spacing plate and the adsorption member.