| 摘要 |
PURPOSE: A power semiconductor mounting package equipped with a ball grid array is provided to easily mount a power switch to a printed circuit board, with high reliability, using a ball grid array usually used for a non-power device. CONSTITUTION: A package mounting a power semiconductor device on a printed circuit board, possesses a ceramic plate(5) possessing an upper surface and an under surface, and a grid hole(10) piercing this plate(5). A plurality of conductive metal contact pads(25A-25C), which provide the power semiconductor device with electrical connections, are provided on the upper surface of the ceramic plate(5), and holes(10) are filled with a conductive metal. The holes(10) filled with metal are connected to the conductive metallic contacts(25A-25C), and they provide conductive paths(15) beginning from the pads to the under side surface of the ceramic plate(5). The array of solder balls contacts with the conductive path(15) at the under side surface of the ceramic plate(5), and it provide the connector terminal to a printed circuit board. |
