发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE: To promote miniaturization of dynamic random access memory(DRAM) having a capacitive element using as an electrode material a film containing a platinum group metal, a platinum group alloy or a conductive oxide of the platinum group metal as a main component. CONSTITUTION: Grooves 44 are made in on a silicon oxide film 43, and then a Pt film 45 is formed within the grooves 44 by electroplating for forming a conductive underlying film 42 previously formed on a lower layer of the film 43 as a cathode electrode. Thereafter, the film 32 is etched and removed, and thereafter the underlying film 42 is subjected to a dry etching process with use of the Pt film 45 as a mask, thus forming a lower electrode of a capacitive element with use of the Pt film 45 and the conductive underlying film 42 remaining thereunder.
申请公布号 KR20010014841(A) 申请公布日期 2001.02.26
申请号 KR20000022683 申请日期 2000.04.28
申请人 HITACHI LTD 发明人 ASANO ISAMU;NAKAMURA YOSHITAKA;OJI YUZURU;SAITO TATSUYUKI;YUNOGAMI TAKASHI
分类号 H01L27/04;H01L21/02;H01L21/28;H01L21/288;H01L21/822;H01L21/8242;H01L21/8246;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L27/10 主分类号 H01L27/04
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