| 摘要 |
PURPOSE: A super-flatening high accuracy control-type grinding device is provided to execute the chemical and mechanical grinding at a high speed with high uniformity by comprising at least two elastic wave detecting elements, a means for monitoring the elastic wave by using the detecting elements, and a means for flattening a structural surface of a structure to be ground. CONSTITUTION: AE waves(elastic wave)(141,142) produced from a chemically and mechanically ground part are respectively observed by a first probe(1)(elastic wave detecting element) and a second probe(12), and monitored. The grinding condition is determined on the basis of the monitoring to flatten a structural surface of a structure to be ground. That is, the chemical and mechanical grinding is executed by mounting a wafer(17) on a head(15) of a super flattening high accuracy control-type grinding device(10), and mounting the first probe(11) and the second probe(12). Whereby the flattening process of the structural surface in accompany with the difference in stage or defects of an optical structure, or the chemical and mechanical grinding process can be uniformly executed at a high speed by detecting the elastic waves(AE wave or phonon echo).
|
