| 摘要 |
<p>PURPOSE: A carrier head having compressible film is provided to prevent the uneven polishing generated in CMP by desired mechanical or chemical processes. CONSTITUTION: The carrier head(100) for the chemical and mechanical polishing process comprises a base(104), a first flexible film(118) extended below the base to form a first compressible chamber(120), a support structural body(114) arranged in the(120), and a compressible film(180) adjacent to a bottom surface of the support structural body(114). A substrate mounting surface is provided on a lower side of the first flexible film(118). The compressible film(180) has a plurality of openings arranged in a pattern to establish the pressure distribution on the upper side of the first flexible film(118).</p> |
