SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

A semiconductor manufacturing apparatus according to an embodiment comprises a reaction chamber in which a semiconductor substrate is capable of being accommodated when a deposited film is to be formed on a surface of the semiconductor substrate. A first supplier supplies a source gas to a first area in the reaction chamber. A second supplier supplies an oxidation gas to a second area in the reaction chamber. A third supplier supplies a hydrogen gas to a third area between the first area and the second area in the reaction chamber. A stage moves the semiconductor substrate to any one of the first to third areas.

主权项

1. A semiconductor manufacturing apparatus comprising:
a reaction chamber in which a semiconductor substrate is capable of being accommodated when a deposited film is to be formed on a surface of the semiconductor substrate; a first supplier supplying a source gas to a first area in the reaction chamber; a second supplier supplying an oxidation gas to a second area in the reaction chamber; a third supplier supplying a hydrogen gas to a third area between the first area and the second area in the reaction chamber; and a stage moving the semiconductor substrate to any one of the first to third areas.