SELECTIVE DEPOSITION

摘要

Methods are provided for selectively depositing a surface of a substrate relative to a second, different surface. An exemplary deposition method can include selectively depositing a material, such as a material comprising nickel, nickel nitride, cobalt, iron, and/or titanium oxide on a first surface, such as a SiO2 surface, relative to a second, different surface, such as a H-terminated surface, of the same substrate. Methods can include treating a surface of the substrate to provide H-terminations prior to deposition.

主权项

1. A deposition method comprising:
providing a substrate comprising a first surface and a second, different surface, wherein the first surface comprises at least one AHx termination, where A is one or more of N, O, or S and x is from 1 to 2, and the second surface is a H-terminated surface; and contacting the substrate with a first vapor phase precursor comprising Ni, Ti, Fe, or Co; thereby selectively depositing a material comprising Ni, Ti, Fe, or Co on the first surface of the substrate relative to the second surface of the same substrate.